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Arizona State University Knowledge Enterprise Advanced Electronics and Packaging Core Facility (RRID:SCR_028600)Copy Citation Copied
URL: https://cores.research.asu.edu/aep
Proper Citation: Arizona State University Knowledge Enterprise Advanced Electronics and Packaging Core Facility (RRID:SCR_028600)
Description: Facility provides comprehensive electronics fabrication and packaging capabilities bridging the high risk, resource-intensive gap between innovation and product development in an information-secure environment. AEP offers backplane electronics design, device fabrication, fanout wafer level packaging, electrical device test and integration capabilities, and operates dedicated pilot line toolsets for technology development. Assists with thin film processing, thin film characterization, device packaging and characterization, photolithography, etching, and flexible electronics. AEP is capable of processing 2 wafers all the way up to 300 mm round wafers.Services include microelectronic device prototyping and packaging, wafer coating or cleaning, wafer metrology, and pilot scale product demonstration. AEP is equipped with the tools and expertise to help take your electronic device from prototype fabrication to final packaging.
Synonyms: Arizona State University Knowledge Enterprise Advanced Electronics and Packaging Core Facility
Resource Type: service resource, access service resource, core facility
Keywords: ABRF, electronics fabrication and packaging, microelectronic device fabrication and packaging, thin film processing, thin film characterization, wafer coating or cleaning, wafer metrology,
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The NIDDK Information Network (dkNET) serves the needs of basic and clinical investigators by providing seamless access to large pools of data and research resources relevant to the mission of The National Institute of Diabetes Digestive and Kidney Diseases (NIDDK). dkNET is hosted at University of California San Diego, and is supported by NIH NIDDK grant U24DK097771.
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